Standard

 

ELC 116 - Soldering Technology II

Course Description:

Emphasizes development of skills in reworking and repairing of electronics circuits. Topics include: soldering and desoldering, advanced repair and rework problems, and construction techniques.

 

Competency Areas:

Hours

 

Soldering and Desoldering

Class

1

Advanced Repair and Rework Problems

D. Lab

1

Construction Techniques

P. Lab/O.B.I.

0

 

Credit

1

Prerequisite:  ELC 104, ELC 115

Corequisite:

 

 

Course Guide

 

Competency

After completing this section, the student will:

Hours

Class

D. Lab

P. Lab/

O.B.I.

SOLDERING AND DESOLDERING

2

2

0

Techniques

Demonstrate proper soldering and desoldering techniques on PC boards.

 

 

 

ADVANCED REPAIR AND REWORK PROBLEMS

4

2

0

Procedures

Explain and demonstrate repair of damaged PC boards.

 

 

 

 

Explain precautions when repairing multilevel PC boards.

 

 

 

CONSTRUCTION TECHNIQUES

4

6

0

Tools

List tools and hardware generally associated with a construction project.

 

 

 

Solderless connectors

Demonstrate the use of solderless connectors.

 

 

 

Splices

Demonstrate how to make Western Union and Bell splices.

 

 

 

 

Tape and heat shrink insulation on splices.

 

 

 

Harnessing

Demonstrate methods of routing and use of wire harnesses, stays, wire ties, and lacing twine.

 

 

 

Wire wrap

Demonstrate proper use of a wire wrap tool.

 

 

 

 

Suggested Resources

 

Books:

 

Heiserman, R. L (1983). Printed circuit boards. New York: John Wiley and Sons.

PACE. (1979). Basic soldering for electronics. Laurel, MD: Author.

Reis, R. A. (1989). Electronic project design and fabrication. Columbus, OH: Merrill.

 

Video:

 

Electronic Industry Association. High tech soldering (Video). Bethesda, MD: Author.